Ube Material Industries，Ltd.
Inquiries about this product
Toyotsu Chemiplas Corporation
Polymer Additives Group
TEL：03-4306-8662
[ubematerials]
Thermal conductive filler is a filler that fills the resin to give heat dissipation (make it easier to conduct heat).
In the past, MgO was often shunned as highly hygroscopic.
Our MgO has improved hygroscopicity by firing at high temperature (1800-2000 ℃) and
unique reaction conditions.
We are a comprehensive manufacturer of MgO, and we can provide a stable supply
through integrated production from raw materials.
We offer high thermal conductivity filler MgO with excellent thermal conductivity at low cost.
| Product Name | Description |
|---|---|
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Average Particle Size 70～110μm |
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Average Particle Size 70-110μm, Vinyl-based Surface-Treated Products |
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Average Particle Size: 40～70μm |
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Average Particle Size 40-70μm, Vinyl-based Surface-Treated Products |
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Average Particle Size: 40～70μm, Phenyl-Based Surface-Treated Products |
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Average Particle Size: 40-70μm, Amino surface-treated products |
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Average Particle Size 7～15μm |
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Average Particle Size 7-15μm, Vinyl-based Surface-Treated Products |
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Average Particle Size 7-15μm, Phenyl-Based Surface Treated Products |
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Average Particle Size: 7-15μm, Amino surface treatment products |
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Average Particle Size 4-10μm |
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Average Particle Size 4-10μm, Vinyl-based Surface-Treated Products |
UBE Thermal Conductive MgO Filler
MgO as the Radiation Filler
Characteristic of UBE MgO filler
・Improved anti hydration properties by high temperature sintering (1,800-2,000ﾟC)
and original controlled reaction condition.
・Stable supply by integrated manufacturing.
・Lower price
Characteristice of substances
| Filler | Thermal conductivity(W/mk) | Specific resistance | Hardness | Water resistance |
| (W/mK) | (Ω cm) | |||
| Magnesia | 42～60 | 1×1017 | 6 | △ (UBE MgO filler○) |
| Alumina | 26～36 | 1×1015 | 12 | 〇 |
| Hexagoal boron nitride | 31～60 | 1×1014 | 2 | 〇 |
| Aluminum nitride | 180～270 | >1×1014 | 8 | △ |
※ These figures refer technical books published by Technology Information Institute co.ltd. in Japan and refer public information on web site.
High thermal diffusivity
Thermal diffusion of compound resin, EEA-resin : filler = 1:3 (weight ratio.)
Thermal diffusivity evaluation by thermograph.
SEM image
Median diameter 10 μm
Median diameter 50 μm
Moisture absorbency resistance at Temp. 85℃-85％RH-48h
Weight increase ratio (%)
Application
●Thermoplastic resin：PA6, PPS, PBT
●Molding resin：EMC, LED